BGA Rework station ZM-R6000
Large area of infrared carbon fiber Pre-heating system, with the advantage of pre-heating fast and evenly and no light pollution.
Temperature parameters protected by limits of authority, for avoiding error settings. Repair
Ten segments of temperature control process, suitable for all kinds of BGA Rework Station.
Unlimited storage of the temperature profile, just need press one key to use the profile.
Three K-type sensors available can realize the high precise temperature testing of each point of PCB or BGA, and PC can generate report of curves analysis automatically.
Desoldering and soldering automatically, No need the manual adjustment.
BGA rework station ZM-R6000 Hot air flow can be adjustable to meet the demand of any chips.
USB Connection driver-free, PC control.
The bottom hot air lifting control available in the front panel, bga machine is convenient to adjust at any time.
Power supply: AC 220V 50/60 Hz
Total power: Max 4000W
Top hot air heater power: 800w
Bottom hot air heater power: 800 W
IR preheating power: 2400 W
Hot air heating temp: 400°C(Max)
Bottom preheating size: 400mmx300mm
Max available PCB size: 400mmx380mm
Available chip size: 2x2mm–60x60mm
Communication: USB Connection, PC Control
Test temperature port: 3pcs
Net weight: Around 25kg
Διάμετρος Καλωδίων: 6mm